DILB32P-223TLF
- Hersteller-Teilenummer
- DILB32P-223TLF
- Hersteller
- Amphenol Communications Solutions
- Paket/Karton
- -
- Datenblatt
- Herunterladen
- Beschreibung
- CONN IC DIP SOCKET 32POS TINLEAD
- Lagerbestand
- 35000
Angebot anfordern (RFQ)
- * Kontaktname:
- Unternehmen:
- * E-Mail:
- Telefon:
- Kommentar:
- Hersteller :
- Amphenol Communications Solutions
- Produktkategorie :
- IC Sockets
- Contact Finish - Mating :
- Tin-Lead
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 100.0µin (2.54µm)
- Contact Finish Thickness - Post :
- 100.0µin (2.54µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyamide (PA), Nylon
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -55°C ~ 125°C
- Product Status :
- Active
- Termination :
- Solder
- Datenblätter
- DILB32P-223TLF
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